Evaluation of the Square-Root-t Method in Junction Temperature Measurement
Konferenz: PCIM Asia 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
26.06.2019 - 28.06.2019 in Shanghai, China
Tagungsband: PCIM Asia 2019
Seiten: 5Sprache: EnglischTyp: PDF
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Autoren:
Cao, Haiyang (Delta Power Electronic Center, Shanghai, China)
Zeng, Guang (Chemnitz University of Technology, Chemnitz, Germany)
Inhalt:
The determination of chip temperature is a key element in the reliability assessment and thermal characterization of the power semiconductor devices. In modern power semiconductor devices like IGBTs, the square-root-t method can cause deviation in the determination of the maximum junction temperature (Tvj(max)). The influence of boundary conditions (such as power loss density) on the applicability of the square-root-t method will be evaluated in this paper and a new fitting method will be introduced.