Reliable High-temperature SiC Power Module for Automotive Traction Inverter

Konferenz: PCIM Asia 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
26.06.2019 - 28.06.2019 in Shanghai, China

Tagungsband: PCIM Asia 2019

Seiten: 7Sprache: EnglischTyp: PDF

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Autoren:
Liu, Chunlei; Schuderer, Juergen; Pavlicek, Niko; Salvatore, Giovanni; Loisy, Jean-Yves; Schroeder, Arne; Torresin, Daniele; Gradinger, Thomas; Baumann, David; Mohn, Fabian (ABB Corporate Research, Switzerland)
Apelsmeier, Andreas (AUDI AG, Germany)

Inhalt:
For application in the automotive powertrain, a reliable, high-temperature operation of SiC power semiconductors is a promising feature. However, high-temperature operation is not only limited by the device capabilities, but also by the packaging technologies used. In this paper, a novel power semiconductor module packaging concept for the automotive powertrain is demonstrated. The concept is based on Ag-sintering, heavy Cu wire interconnection and ultrasonic welded terminals. All solder-free interconnects provide superior reliability in order to meet future automotive requirements, e.g., 1000 temperature cycles in the temperature range -40 °C to 175 °C, high temperature storage at 200 °C /1000 hours and excellent power cycling reliability, e.g. > 1 million cycles at DeltaT = 100 K, Tj,max = 200 °C. In addition, epoxy molded modules in half-bridge configuration are designed for environmental robustness, easy inverter integration and low costs. The current power module package can accommodate both SiC and Si chips to offer a simple scalability for inverter classes in the 150 – 300 kW power range.