High Efficiency Cooling Technology for High Power Density Automotive IGBT Module
Konferenz: PCIM Asia 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
26.06.2019 - 28.06.2019 in Shanghai, China
Tagungsband: PCIM Asia 2019
Seiten: 6Sprache: EnglischTyp: PDF
Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Autoren:
Yamauchi, Kohei; Gohara, Hiromichi; Kai, Kenshi; Satou, Kenichiro; Yoshida, Souichi; Mochizuki, Eiji; Shiohara, Kazuyoshi; Yamazaki, Tomoyuki (Fuji Electric Co., Ltd, Japan)
Inhalt:
We applied a new aluminum direct liquid cooling technology to next-generation standard IGBT module for xEV applications. By applying new wave fin structure which can effectively dissipate the heat generated by power semiconductor devices, high cooling capability is achieved, and balanced flow speed distribution was successfully improved as well. Through visualization experiments, we confirmed that the development of the boundary layer was suppressed and the flow velocity on the fin surface increased. Similarity between the experimental flow pattern and its simulated counterpart was also verified. Our newly developed direct liquid cooling IGBT module with high performance wave fin realized 20% reduction in thermal impedance, compared with conventional ones.