A new, intelligent power module with higher power density and smallest package size
Konferenz: PCIM Asia 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
26.06.2019 - 28.06.2019 in Shanghai, China
Tagungsband: PCIM Asia 2019
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Young, Sungmo; Lee, Taejin; Choo, Byoungho; Son, Joonseo (Infineon Technologies Korea, South Korea)
Chen, Zhou (Infineon Technologies Americas, USA)
Inhalt:
Power density is a key performance indicator for inverters. To keep pace with actual trends, two technical challenges should be resolved for power modules comprised of IGBTs and diodes. The IGBTs and diodes have to provide better performance in terms of static and dynamic losses. A new package development is also necessary to meet the various requirements such as isolation distance and mounting methods used. This paper introduces Infineon’s CIPOS(exp TM) Tiny, a new IPM (Intelligent Power Module) offering a three-phase inverter up to 20 A in the smallest available, fully isolated, and thermally enhanced package.