Wiring technology for upcoming generation power module

Konferenz: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.07.2020 - 08.07.2020 in Deutschland

Tagungsband: PCIM Europe digital days 2020

Seiten: 5Sprache: EnglischTyp: PDF

Autoren:
Uchida, Yoshihisa; Izuo, Shinichi; Arai, Kiyoshi; Kikuchi, Masao (Mitsubishi Electric Corporation Power Device Works, Japan)

Inhalt:
As the utilization field of power modules has been expanding, power modules will be required higher performance than current products. To achieve market demands, it is essential to develop wiring technologies which have impact on lifetime, package size and power density of power modules. Although Al wedge wire bonding technology has been conventionally using, lifetime of module is mainly influenced by the fatigue life of wire bonding junctions on chips and wire bonding areas often become a limitation to package shrink. To solve this matter we have developed novel inner wiring technologies such as applying new wiring material, direct lead bonding (DLB) technology to case type module.