Potential and challenges of additive manufactured substrates and auxiliary material for electronics
Konferenz: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.07.2020 - 08.07.2020 in Deutschland
Tagungsband: PCIM Europe digital days 2020
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Schleicher, Michael (SEMIKRON Elektronik GmbH & Co. KG, Germany)
Matthes, Michael (WITTENSTEIN cyber motor GmbH, Germany)
Platz, Hanno (GED Gesellschaft für Elektronik und Design, Germany)
Inhalt:
Additive manufacturing principles will enforce within the industry next few years [Fig. 1]. A new manufacturing approach together with the IoT or “Industrie 4.0” will be established. The reduction of resources and individualized production is an additional driver for additive manufacturing. In a short overview, based on three representatives - soldermask, sinter paste and PCB substrate - the current status of additive manufacturing within the electronic production will be shown. To obtain the benefit of those technologies the hitherto used process-flow, Tools (eCAD) and used Data formats must change. The “FED Arbeitskreis 3D-Elektronik” prepares the knowledge regarding to these new proceedings for its member and interested experts.