Wafer Level Silver Sintering Die Attach for Power Discretes

Konferenz: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.07.2020 - 08.07.2020 in Deutschland

Tagungsband: PCIM Europe digital days 2020

Seiten: 5Sprache: EnglischTyp: PDF

Autoren:
Dutt, Gyan; Khaselev, Oscar; Boureghda, Monnir; Joguet, Julien (MacDermid Alpha Electronic Solutions, USA)
Fenech, Maurizio (MacDermid Alpha Electronic Solutions, Germany)

Inhalt:
While silver sintering has emerged as the die-attach material of choice for high power devices (especially automotive modules), high-lead soft solder is still used for power discretes. As dies get thinner, temperature dependent RDS(on) (drain-to-source resistance) is becoming the bottleneck for meeting the electrical requirements. We have developed a silver sintering die-attach film designed for application at wafer level. It delivers the superior reliability and performance of silver sintering in a high throughput process that utilizes a standard epoxy die bonder. This paper describes the challenges and process solutions for using the wafer level silver sintering film.