Novel Joining Technologies in Traction Power Semiconductor Modules for Fulfillment of Roll2Rail Requirements

Konferenz: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.07.2020 - 08.07.2020 in Deutschland

Tagungsband: PCIM Europe digital days 2020

Seiten: 6Sprache: EnglischTyp: PDF

Autoren:
Beyer, Harald; Maleki, Milad; Bayer, Martin; Fischer, Fabian; Paques, Gontran (ABB Power Grids Switzerland Ltd., Semiconductors, 5600 Lenzburg, Switzerland)

Inhalt:
Power semiconductor modules undergo extreme thermal excursions, which require reliable joining connections. Enhanced customer requirements like the Roll2Rail target specification for future traction applications are enforcing the replacement of standard joining technologies. In this work, the power cycling reliability of IGBT devices was investigated, whereby the emitter contact was prepared by novel bond wires and the chips were sintered to substrates. A significant improvement of the reliability was achieved compared to samples having conventional aluminum wire bonding and soldering connections, indicating a fulfillment of Roll2Rail. In addition, this paper also presents the evaluation of a power cycling test done on substrate level and the translation method to a large power module with base plate and several substrates.