Experimental estimation of PCB thermal resistance for different configurations and types of vias
Konferenz: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.07.2020 - 08.07.2020 in Deutschland
Tagungsband: PCIM Europe digital days 2020
Seiten: 5Sprache: EnglischTyp: PDF
Autoren:
Kalugin, Nikolay; Firsov, Mikhail; Matveev, Andrey (KW-Systems LLC, Russia)
Inhalt:
The results of comparative analysis and measurements of thermal resistances of PCB (Printed circuit boards) are presented. Various configurations and types of thermal vias have been investigated. The information is useful for calculating the maximum power transfer from top to bottom of the PCB.