Low Shrinkage EMC (Epoxy Molding Compound)
Konferenz: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.07.2020 - 08.07.2020 in Deutschland
Tagungsband: PCIM Europe digital days 2020
Seiten: 4Sprache: EnglischTyp: PDF
Autoren:
Oh, Hwasuck; Park, Chan Young; Shim, MyongTaek; Kwon, YoungEun; Kong, Byung-Seon (KCC, Korea)
Inhalt:
A new type of epoxy resin based EMC (Epoxy Molding Compound) was developed to relieve thermal stress of high temperature driving power module and improve the package anti-crack and warpage characteristics. The new epoxy resin was effective on improving warpage performance through a lower shrinkage rate at the same filler content. Also, package reliability can be improved by low modulus characteristics of newly developed EMC.