3D-Printed Fluid-Cooler Baseplate for Si-IGBT Modules

Konferenz: PCIM Asia 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
16.11.2020 - 18.11.2020 in Shanghai, China

Tagungsband: PCIM Asia 2020

Seiten: 5Sprache: EnglischTyp: PDF

Buendgen, David; Stippich, Alexander; De Doncker, Rik. W. (Institute for Power Electronics and Electrical Drives, RWTH Aachen, Germany)

Due to the rising demand for highly integrated power electronics and high power-density converters, a 3D-printed and integrated cooling structure for IGBT modules is investigated. Currently, state of the art Si-IGBT modules are constructed on a metal baseplate to ensure mechanical stability and a high thermal connectivity to a cooler via a thermal interface material. To avoid the extra thermal resistance of the baseplate and the thermal interface material and to reduce the overall size of the IGBT cooling structure, a 3D-printed fluid-cooled baseplate is utilized. Furthermore, a dual-sided cooling-baseplate is presented. Measurements are conducted to ensure the feasibility and performance of the proposed concepts. Moreover, a comparison between the introduced modules is conducted. It is found that the cooler baseplate has a lower thermal resistance from junction to coolant then a module with a cooper baseplate while reducing the total volume of the cooling structure.