Power Package Attach by Silver Sintering – Process, Performance & Reliability

Konferenz: PCIM Asia 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
16.11.2020 - 18.11.2020 in Shanghai, China

Tagungsband: PCIM Asia 2020

Seiten: 5Sprache: EnglischTyp: PDF

Fenech, Maurizio; Susanti, Liliyani (MacDermid Alpha Electronics Solutions, Langenfeld, Germany)
Siebenhuhnner, Matthew; Durham, Jeffrey; Khaselev, Oscar; Boureghda, Monnir; Joguet, Julien; Dutt, Gyan (MacDermid Alpha Electronics Solutions, Corporate Blvd, NJ, USA)
Wu, Wilson (MacDermid Alpha Electronics Solutions, Shenzhen, China)

Smaller transfer-molded power modules are gaining popularity as a readily scalable alternative for building electric vehicle inverters without the necessity of designing and qualifying the module (and its die package). Proper thermal control is imperative for the optimal operation of such devices and there are now several single-side cooled power modules which can be readily sintered directly to a heat sink. In this paper we present the sintering process to assemble these power modules for inverter assembly. Sintering material application process, drying and sintering conditions are described. The sintered assemblies are then characterized by package shear, thermal shock and thermal impedance tests.