Advanced Power Module Technologies for Wide Band Gap Devices

Konferenz: PCIM Asia 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
16.11.2020 - 18.11.2020 in Shanghai, China

Tagungsband: PCIM Asia 2020

Seiten: 5Sprache: EnglischTyp: PDF

Liao, Hsueh-Kuo; Chi, Wei-Hao; Huang, Yu-Wen; Chen, Hao-Chih; Hsu, Hao-Chiang; Guo, Siao-Wei (Delta Electronics, Inc., Taoyuan City, Taiwan, China)

implemented by advanced power module technologies. Sintering Ag is one of high temperature die attach candidates, its shear strength keeps the same level before / after 175 °C and 250 °C more up to 2000hrs. Surge current test results show no different after high temperature aging test. Furthermore, Wire-less/ Wire-free module structures remove bond wires and contribute low thermal resistance (-20 % / -73 %). The new power modules, wire-less/ wire-free structures, are discussed in thermal, electric, stray inductance, and reliability fields in the work. Both of these two structures could improve cycle life reliability compared to the wire-bond type.