High Power and High Integration Transfer-mold Type IPM

Konferenz: PCIM Asia 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
16.11.2020 - 18.11.2020 in Shanghai, China

Tagungsband: PCIM Asia 2020

Seiten: 4Sprache: EnglischTyp: PDF

Huang, Hongguang (Mitsubishi Electric & Electronics (Shanghai) Co., Ltd, China)
Zhang, Hongbo (Power Device Works, Mitsubishi Electric Corporation, Japan)
Chen, Jian (Mitsubishi Electric GEM Power Device (Hefei) Co., Ltd, China)

This paper presents a new 1200V class transfer-mold type high power and high integration IPM launched by Mitsubishi Electric and its advantages in application. With the 7th generation IGBT chip of Mitsubishi Electric and abundance integrated functions, Large DIPIPM+ series product achieves high performance and can reduce total cost of system. Of special note, the new series extend the product line-up of Mitsubishi Electric transfer-mold IPMs up to 100A/1200V for motor drive applications such as commercial air conditioner and so forth.