Encapsulation Technology of Epoxy Resin for High Temperature Operating Power Modules

Inhalt:
The encapsulation of power modules has functions, such as to protect semiconductors and wiring materials from thermal shock, physical attack, and foreign objects from outside, to ensure insulation. Recently power modules are required to be higher current density and operating temperature, therefore encapsulation technologies which materials and process are also required to improve. In this paper, the latest development results of encapsulation technology for higher temperature operating and current density are reported.