A Framework for Reliability Analysis of a SiC Converter for Automotive On-Board Charger Applications

Konferenz: PCIM Europe digital days 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
03.05.2021 - 07.05.2021 in Online

Tagungsband: PCIM Europe digital days 2021

Seiten: 8Sprache: EnglischTyp: PDF

Autoren:
Diaz Reigosa,Paula; Keller, Thomas; Strittmatter, Tobias; Pendharkar, Ishan; Schulz, Nicola (Institute of Electric Power Systems, University of Applied Sciences & Arts Northwestern Switzerland, Windisch, Switzerland)

Inhalt:
In this paper a method for analyzing reliability of SiC Devices used in a Dual Active Bridge converter is developed. The reliability analysis can be carried out using a simulation model to estimate junction temperature (thermal stresses) of the devices based on realistic mission profiles. The simulation model used for thermal stress estimation has been tuned with laboratory experiments to match power losses and junction temperatures. Applications of the proposed method include: optimal choice of semiconductor materials, evaluation of control schemes, increasing power density.