Expanding the Output Power of PrimePACK(TM) with RC-IGBT in Industrial Applications
Konferenz: PCIM Europe digital days 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
03.05.2021 - 07.05.2021 in Online
Tagungsband: PCIM Europe digital days 2021
Seiten: 7Sprache: EnglischTyp: PDF
Autoren:
Kleingrothe, Lukas (Fuji Electric Europe GmbH, Germany)
Ebukuro, Yuta; Yamano, Akio; Kakefu, Mitsuhiro; Oda, Yuki; Mitsuzuka, Kaname; Momota, Seiji; Itoh, Taichi; Okita, Souichi; Yoshiwatari, Shinichi; Kobayashi, Yasuyuki (Fuji Electric Co. Ltd., Japan)
Inhalt:
In this paper, the output power expansion of PrimePACK(TM) modules for industrial applications is described. IGBT modules have been increasingly required to be smaller in size while exhibiting lower power dissipation and higher reliability. To meet the market requirements, Fuji Electric Co. Ltd. has commercialized PrimePACK(TM) 3+ for industrial applications which combines 7th generation X series technology and RC-IGBT (Reverse Conducting IGBT) technology that integrates a IGBT chip and a freewheeling diode (FWD) chip into one chip. The PrimePACK(TM) 3+ is available in 1,200V and 1,700V ratings. Both rated products have significantly improved power dissipation and reliability compared with conventional PrimePACK(TM). With these improvements, the output power expansion that is difficult with the conventional IGBT and FWD combination module has been achieved.