Retrofit of a Superstar: New EconoDUAL(TM) 3 Black Series combines new Features with Well-Known Advantages

Inhalt:
The Infineon EconoDUAL(TM) 3 (ED3) is one of themost popular power electronic packages on themarket. It has been in use since 2005 in key applications such as general-purpose drives (GPD), electric buses and trucks, solar, wind, uninterruptible power supplies (UPS), chargers, and traction. It is available today with a variety of IGBT technologies and topologies as well as with integrated shunts. Besides its practical module geometry, which simplifies inverter designs, this housing is famous for its high power density, easy mounting, generous space on top for driver boards, and its simple paralleling. After 15 years, it is now time for a retrofit, to adapt this housing to modern market requirements. The housing has now been improved for use in automated production lines, with an even easier press-in process for high-current printed circuit boards (PCBs). It is designed for future IGBT generations, and has a perfect price/performance ratio. Not to be forgotten is its formula for success, spanning over a decade: The module footprint remains the same as that of the current EconoDUAL(TM) 3 to ensure the same well-known advantages. All this is in keeping with the trends in modern society to conserve resources and live sustainably. In this paper, the balancing act between the introduction of new features of the new EconoDUAL(TM) 3 Black Series and the preservation of tried and tested properties, will be presented. The study of the new device FF600R12BE7_B11 (BE7) uses the 1200 V TRENCHSTOP(TM) IGBT7 and the emitter-controlled diode EC7 technology.