A New High Power Density 6-in-1 IGBT Module Enabling Acceleration of Vehicle Electrification

Konferenz: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2022 - 12.05.2022 in Nürnberg, Germany

doi:10.30420/565822021

Tagungsband: PCIM Europe 2022

Seiten: 6Sprache: EnglischTyp: PDF

Autoren:
Takeuchi, Yujiro; Kamikawa, Masayuki; Kumagai, Yukihiro; Wada, Takashi; Tanimura, Toshiki; Ouchi, Takayuki; Tsuruoka, Hisayuki; Hayakawa, Seiichi; Kushima, Takayuki; Hisada, Kenichi; Kato, Yutaka; Shiraishi, Masaki; Oda, Tetsuo (Hitachi Power Semiconductor Device, Ltd., Japan)

Inhalt:
In this paper, a high power density 750 V/800 A 6-in-1 IGBT module suitable for xEV application was newly proposed. In order to reduce power loss, side gate HiGTs and U-SFDs were installed that can achieve both low switching loss and low noise. In addition, the Cu lead structure was applied for down-sizing and improvement of thermal resistance. Epoxy resin encapsulation contributes to the advance of mechanical vibration resistance and thermal stress reliability. By integrating the above technologies, the developed module can achieve a −29% smaller footprint and a −27% lighter weight while keeping the same output current as our conventional IGBT module. Consequently, the developed module can realize a +70% higher power density than the conventional one.