Benefits of SiC in On-Board Charger Applications

Konferenz: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2022 - 12.05.2022 in Nürnberg, Germany

doi:10.30420/565822028

Tagungsband: PCIM Europe 2022

Seiten: 7Sprache: EnglischTyp: PDF

Autoren:
Holzmann, Lisa; Rosam, Ben; Schmidt, Marco; Muenzer, Mark; Huerner, Andreas (Infineon Technologies AG, Germany)

Inhalt:
High power automotive applications such as on-board-charger (OBC) or high voltage to low voltage (HV-LV) DCDC converters face various challenges at the system level such as, increased power density, increased level of integration, higher switching frequencies and increased efficiency. 1200 V SiC MOSFETs are key components used in high voltage OBC/DCDC application to overcome these system challenges. Both technology and package play an important role. This paper discusses the aspects of a 1200 V SiC MOSFET technology, especially designed for high switching applications that can bring benefits at the system level, the different surface mount package solutions, and explains how a well-known bottom side cooled D2PAK solution can be adopted to fulfill the high voltage application conditions. Furthermore, this paper highlights a new type of power package with top-side cooling capability that enables HV systems to reach higher power densities in next generation OBCs.