Design Tool for Temperature Estimation on PCB

Konferenz: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2022 - 12.05.2022 in Nürnberg, Germany

doi:10.30420/565822123

Tagungsband: PCIM Europe 2022

Seiten: 5Sprache: EnglischTyp: PDF

Autoren:
Schroeder, Bernd; Stube, Bernd (TU Berlin FSP Technologies of Microperipherics, Berlin, Germany)
Hoffmann, Stefan; Hoene, Eckart (Fraunhofer Institute for Reliability and Microintegration IZM, Berlin, Germany)
Mueller, Olaf (AEconversion GmbH & Co.KG, Bad Sassendorf, Germany)

Inhalt:
The paper presents a novel thermal analysis approach based on an estimation of current density, power dissipation and temperature distribution of a printed circuit board. The implemented algorithms are integrated in a design tool that can be used as an add-on tool via interfaces to commercial EDA tools. The calculations are based on imported layout data from the EDA tools and not on Gerber data. The current density is calculated with a separate PEEC solver. The developed design tool automatically generates the necessary 3D model, activates the PEEC solver and extracts its calculation results. Subsequently, the implemented thermal solver of the design tool calculates the power dissipation and temperature distribution for a previously assigned current. This efficiently supports the PCB designer already during the layout process. The method is validated by simulations and measurements on typical boards.