First 650V 60A GaN Power Module in a Compact SP1 Package
Konferenz: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2022 - 12.05.2022 in Nürnberg, Germany
doi:10.30420/565822140
Tagungsband: PCIM Europe 2022
Seiten: 8Sprache: EnglischTyp: PDF
Autoren:
Doumergue, Pierre-Laurent; Bontemps, Serge (Microchip Technology, Bruges, France)
Inhalt:
This paper presents the characterization of a new 650 V / 60 A Full GaN HEMT cascode phase leg module in a compact SP1 package featuring a 51.6 x42.5 mm2 footprint. This module is built with DBC on AlN substrates and multiple GaN devices are paralleled to meet the rated current.