First Aerospace-qualified Baseless SiC Power Module Family Improves High Reliability Systems Efficiency
Konferenz: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2022 - 12.05.2022 in Nürnberg, Germany
doi:10.30420/565822142
Tagungsband: PCIM Europe 2022
Seiten: 10Sprache: EnglischTyp: PDF
Autoren:
Calmels, Alain; Bontemps, Serge; Petrequin, Edouard; Doumergue, Pierre-Laurent; Barriere, Maxime (Microchip Technology Inc, Bruges, France)
O’Donnell, Shane; McAvinue, Bernard; Walsh, Vincent (Microchip Technology Inc, Aerospace IPS Centre, Ennis, Co. Clare, Ireland)
Inhalt:
This paper presents a novel high reliability baseless (i.e., no baseplate/heatsink) power module family and the qualification tests that were completed by Microchip to demonstrate the capability of the First Aerospace-QualifiedBaselesspower module technology to serve aerospace applications with the relevant level of reliability, performance, and maturity. After a presentation of the innovative solutions designed by Microchip to increase the level of reliability of the baseless technology, this paper focuses on the qualification and evaluations performed by Microchip based on the conditions outlinedin RTCA DO-160G (Environmental Conditions and Test Procedure for Airborne Equipment) and in compliance with the civil aircraft environmental conditions.