Reflow Soldering of TO-247PLUS Discrete Package in Commercial, Construction and Agricultural Vehicle Application

Inhalt:
Many applications today use power semiconductors for high power density solutions. One challenge in designing such solutions is a good cooling system to relieve the heat dissipated by the devices. A discrete device that is mounted on a water-cooled heat sink via direct copper bonding (DCB) is one solution available to design engineers, assuming the discrete device can be mounted like a surface-mounted device (SMD). This paper will demonstrate a reflow, solder-capable TO-247PLUS discrete package that minimizes the thermal resistance from the device chip to the DCB substrate.