Additive Manufacturing in Electronics – Filament Overview and Special Focus on Carbon Black Filament Properties Investigation

Konferenz: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2022 - 12.05.2022 in Nürnberg, Germany

doi:10.30420/565822146

Tagungsband: PCIM Europe 2022

Seiten: 9Sprache: EnglischTyp: PDF

Autoren:
Schuhl, Andre; Schiffhauer, Katharina J.; Lemnitz, Emanuel; Schwalbe, Ulf (Hochschule Fulda, Germany)

Inhalt:
Advantages of 3D printing have led to its use in most diverse industries plus the low budget segment in printed electronics. Printing of FDM-printed PCBs with a low budget printer is possible e.g., a connection for small low power sensor and visualisation applications. Already the filaments research for additive manufacturing shows, that the FDM-printed PCB conductivity must be significantly lower compared to copper use. The investigation of FDM-printed PCBs versus conventional PCBs regarding their current-carrying capacity and thermal properties confirm comparable results. The conductive filament can only safely conduct currents in the single-digit mA range at wider cross-sections. Upon higher current application, it exhibits hot conductor properties and a permanently lower conductor resistance. The results reveal new uses, and these provide the opportunity for further investigations.