Analysis of Decoupling Capacitor Effectiveness for Multi-Chip Power Modules

Konferenz: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2022 - 12.05.2022 in Nürnberg, Germany

doi:10.30420/565822237

Tagungsband: PCIM Europe 2022

Seiten: 8Sprache: EnglischTyp: PDF

Autoren:
New, Christopher; Lemmon, Andrew; DeBoi, Brian (The University of Alabama, USA)

Inhalt:
The increased edge rates of wide bandgap (WBG) semiconductors require heightened attention while designing systems to ensure device ratings are not exceeded and to achieve optimal performance. In many applications, it is common practice to attach decoupling capacitors as close as possible to a semiconductor module to protect the device from excessive voltage transients. In some applications, particularly in characterization measurements of multi-chip power modules (MCPM), decoupling capacitors introduce several challenges which undermine their usefulness. This paper discusses these challenges and provides simulation and empirical evidence to indicate that decoupling capacitors are not recommended in most situations when characterizing MCPMs.