Stackpac® – The Smart Chip Package Concept of Possehl Electronics

Inhalt:
The continuous increase of functionality of electronic modules in particular in the field of Industry 4.0 imposes some new requirements on the housing technology. Some of these are the miniaturization combined with raw material savings, the integration of cooling elements, EMC shieldings, wireless communication interfaces, but in particular the stackability of modular microsystems. The integration of higher functionality in the housing previously required very complex technologies. The patented Stackpac(r) concept uses state of the art standard production technologies, which allow a fast and reliable realization in mass production at optimized costs.