Modeling and Thermal Analysis of the ACEPACK SMIT Package in H-Bridge High Voltage Circuits
Konferenz: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2022 - 12.05.2022 in Nürnberg, Germany
doi:10.30420/565822279
Tagungsband: PCIM Europe 2022
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Papaserio, Marco; Longo, Ludovica; Cusumano, Andrea; Sujeet, Arjun; Cascio, Alessandra; Bazzano, Gaetano; Sciacca, Angelo (STMicroelectronics, Italy)
Scelba, Giacomo; Cacciato, Mario (University of Catania, Italy)
Inhalt:
The main aim of this work is to present the thermal analysis of the ACEPACKTM SMIT Package housing a 1200V, 80A Half Bridge silicon carbide (SiC) MOSFET Module, which is operated as DC/DC step down converter. Starting from some preliminary experimental tests, a thermal model is realized with a Multiphysics finite element method (FEM) based software which can be exploited to investigate the thermal distribution in the considered package in a wider operating range, by considering different output power and cooling conditions.