Novel Material Technology Reduces Tool and FixturingComplexity for Solder Preforms in Power Module Assembly

Inhalt:
Manufacturing processes of soldered and sintered power modules have strong influence on costs, reliability, and lifetime of the products. Reliance on complex, costly alignment tooling is growing as power module designers seek improved reliability performance. A novel adhesive material technology, applied to the assembly, eliminates the need for customized fixturing tools during soldering or hot-die tacking for sintering. This no-residue adhesive is demonstrated to achieve exceptional soldering and sintering results without post-process cleaning steps. It is examined for compatibility with solder preforms and prevalent flux-free reflow techniques using N2 environment with or without formic acid. Empirical evidence confirms no residual impact. This results in less up-front design-for-manufacturing effort, reduced product introduction cycles, and lower capital investment, thus reducing the overall cost of ownership to achieve high-quality solder performance for power module assembly. A corresponding evaluation of pre-dried sinter pastes under standard pressure sintering processes is also in process, and will be a focus of future work with this tacking material.