20A/600V RC-IGBT Based Transfer Molded IPM for Home Appliance Application
Konferenz: PCIM Asia 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
26.10.2022 - 27.10.2022 in Shanghai, China
Tagungsband: PCIM Asia 2022
Seiten: 3Sprache: EnglischTyp: PDF
Autoren:
Huang, Hongguang; Wang, Xiaoling (Mitsubishi Electric & Electronics (Shanghai) Co., Ltd, China)
Joko, Motonobu (Mitsubishi Electric Corporation, Japan)
Inhalt:
This paper presents a new large rating current product in SLIMDIPTM series with part No. SLIMDIP-X. Thermal resistance between chip and case Rth(j-c) is reduced approximately 35% lower than conventional SLIMDIP-L (15A/600V). The new 20A/600V reverse-conducting IGBT (RC-IGBT) and the insulation sheet enable this lower thermal resistance. As a result, the allowable output current of inverter system becomes 18% higher than the system adopting SLIMDIP-L. Furthermore, EMI radiation noise is also improved in SLIMDIP-X by new RC-IGBT chip, which enables to reduce the number of noise suppression components and then will lead to smaller and lower-cost inverter system.