Physics-of-Failure Model to Explain the Heating-Time Effect on IGBT Power Modules Lifetime
Konferenz: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09.05.2023-11.05.2023 in Nürnberg, Germany
doi:10.30420/566091007
Tagungsband: PCIM Europe 2023
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Ouhab, Merouane; Degrenne, Nicolas (Mitsubishi Electric R&D Centre Europe (MERCE), France)
Ito, Yusaku; Izuo, Shinichi (Mitsubishi Electric Corporation (MELCO), Japan)
Inhalt:
Heating time (ton) is considered among the most impacting factors on the lifetime of standard power modules (PMs). In this paper, ton-effect is evaluated experimentally using power cycling tests (PCTs) carried out on IGBT PMs, where 400um aluminum wires are used as top interconnections. Post-analysis of tested devices revealed wire bond lift-off as the unique observed failure mechanism. Moreover, a Physics-of-Failure (PoF) model is developed to explain the observed lifetime reduction based on non-linear fracture mechanics, where the creep J integral (J*) is used as a crack driving force at the wire/metallization interface.