Experimental Investigation of Advanced Cu-Mo-Cu Clips for Enhanced Power Cycling Reliability of Die-top Interconnections
Konferenz: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09.05.2023-11.05.2023 in Nürnberg, Germany
doi:10.30420/566091026
Tagungsband: PCIM Europe 2023
Seiten: 5Sprache: EnglischTyp: PDF
Autoren:
Neal, Harley; Li, Xiang; Packwood, Matthew; Malasani, Shreyas; Morshed, Muhammad (Dynex Semiconductor Ltd, Doddington Road, Lincoln, UK)
Inhalt:
We report on the experimental test results of the power cycling lifetime comparison between traditional copper-based clips and the new Cu-Mo-Cu (CMC) clips. By using an in-house power cycling tester, the performance of both types of clips are evaluated comparatively. It is shown that the CMC clips can extend the power cycling lifetime by more than 3 times, due to the thermal expansion coefficient of the material being closer to that of the semiconductor dies. The sample preparation, test algorithm, electrical performance and failure analysis were presented.