Reliability of Molded POL Tile as Simple Module

Konferenz: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09.05.2023-11.05.2023 in Nürnberg, Germany

doi:10.30420/566091070

Tagungsband: PCIM Europe 2023

Seiten: 6Sprache: EnglischTyp: PDF

Autoren:
Murayama, Kei; Kobyashi, Mikiko; Miki, Shota (Shinko Electric Industries Co., Ltd., Japan)

Inhalt:
Demand for power modules is increasing year by year. Require for Electric Vehicle, reduced energy use, and increased efficiency are driving the need for smaller and more common power modules. Power Overlay (POL) tile is a simple power module that meets these requirements. In addition, encapsulation by mold resin is effective in improving reliability and simplifying the assembly process. In this report, the reliability of molded POL tiles was investigated in thermal cycling tests, power cycling tests and high temperature and high voltage reverse bias tests. It was found that molded POL tile as a simple module is highly reliable.