Thermal Evaluation of Substrate Technologies Used for Power Peak Management in SSPC Modules
Konferenz: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09.05.2023-11.05.2023 in Nürnberg, Germany
doi:10.30420/566091194
Tagungsband: PCIM Europe 2023
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Khazaka, Rabih; Youssef, Toni; Gautier, Cyrille; Azzopardi, Stephane (Safran Tech, Electrical & Electronic Systems Research Group, Châteaufort, France &)
Scoggin, Guy; Avenas, Yvan; Schanen, Jean Luc (Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, Grenoble, France)
Muckenhirn, Sylvain; O'Connor, Lesia (Fralock, Specialty Engineered Materials Division, Valencia, California, USA)
Inhalt:
Solid-state power controllers aim to protect and configure electrical systems. They act as a normally-on switch until the occurrence of a short circuit event where the breaking current can reach several times the nominal one. The overheating of power semiconductor devices during this phase should be avoided. This paper aims to investigate the thermal performance of assemblies based on various substrates in order to reduce the thermal impedance in the time range 10 -3 to 1 s. Based on simulations and experimental results, the calculated device junction temperature for a specific overcurrent trip curve is used to select potential technologies. Finally, a comparative analysis between these potential technologies and a conventional substrate joined to various baseplate materials with different thicknesses is achieved.