Impact of SBD Embedding into SiC MOSFETs on Dynamic Behavior at High Temperature
Konferenz: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06.05.2025 - 08.05.2025 in Nürnberg, Germany
doi:10.30420/566541002
Tagungsband: PCIM Conference 2025
Seiten: Sprache: EnglischTyp: PDF
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Autoren:
Asaba, Shunsuke; Furukawa, Masaru; Kono, Hiroshi
Inhalt:
We investigated the impact of integrating Schottky barrier diode (SBD) into silicon carbide MOSFET on their dynamic behavior at high temperatures. We measured the diode characteristics without interference from the switching device. Our findings indicate that SBD integration eliminates the temperature dependence of recovery characteristics and reduces diode recovery loss by 50% at a high temperature of 175deg C. Additionally, we clarified that the reverse recovery behavior affects the turn-on loss of the MOSFETs in the opposite arm of the inverter circuit, and SBD integration also reduces this turn-on loss by 40%.