Advanced Copper-Based CTE-Composites with High Performance vs Cost Ratio Made by a Novel Industrial Technology

Inhalt:
High performance packaging requires a significant increase in thermal conductivity. AlSiC materials are limited and Cu/Mo composites are blocked due to their cost vs performance-increase ratio. Sintered and infiltrated composites are available only at low Cu contents, thereby limiting heat dissipation. Higher conductive CPC (Cu-MoCu-Cu) and CMC (Cu-Mo-Cu) laminates are difficult to produce, sensitive to fatigue and require minimum thickness. The newly industrialized eForging technology (a field-assisted-sintering-technology) overcomes these limitations and produces application tailored composites with homogenous isotropic microstructure, thickness down to 0.5mm in ready to assemble shapes at an attractive performance-vs-cost ratio. With proven capability to produce WCu and Mo components, first results of eForged Cu85Mo15 and Mo70Cu30 show thermal conductivity values of 320-330W/m/K and 178-195W/m/K, respectively. Their thermal expansion coefficient lies with 14-15ppm/K and 11ppm/Kabove existing solutions. Further basic feasibility studies were performed on Graphene and Diamondcomposites to evaluate their manufacturing potential. From all results a component TCO ratio was esti-mated for existing powder-consolidation technologies, the novel eForging process and AlSiC as abenchmark. The results clearly indicate that by combining the cost effectiveness of the eForging tech-nology with the potential to produce high-performance composites, the performance-vs-cost gap can beclosed, and a significantly higher performance level can be introduced efficiently.