LIME: Liquid Metal Packaging for Power Semiconductors
Konferenz: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06.05.2025 - 08.05.2025 in Nürnberg, Germany
doi:10.30420/566541051
Tagungsband: PCIM Conference 2025
Seiten: Sprache: EnglischTyp: PDF
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Autoren:
Baker, Nick; Beczkowski, Szymon; Iannuzzo, Francesco; Pedersen, Kjeld; Aunsborg, Thore; Jorgensen, Asger Bjorn; Lemmon, Andrew; Gupta, Su; Garcia, Ruben; Mshar, Alec
Inhalt:
State-of-the-art power semiconductors use solid metal interconnects such as wire-bonding, soldering, and sintering. Thermo-mechanical stress degrades solid metal interconnects and is the main cause of failure in power semiconductors. This paper uses liquid metals, which are inherently resistant to thermo-mechanical stress, to replace solid metal interconnects. Preliminary results show that the use of liquid metals can increase the thermo-mechanical lifetime of power semiconductors by up to a factor of 40 to 60. Several iterations of liquid metal packages are shown, using both Silicon and Silicon Carbide chips.