Copper sinter paste that can sinter without pressure in nitrogen
Konferenz: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06.05.2025 - 08.05.2025 in Nürnberg, Germany
doi:10.30420/566541116
Tagungsband: PCIM Conference 2025
Seiten: Sprache: EnglischTyp: PDF
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Autoren:
Nakako, Hideo; Ryuya, Nakaomoya; Ishikawa, Dai; Kazuhiko, Minami; Makoto, Mizukami; Yuki, Tanaka
Inhalt:
In this study, we develop a Cu sinter paste for pressure-less sintering in a nitrogen atmosphere. The bonding process of the developed Cu sinter paste involves printing, chip mounting, drying, and sintering. The Cu sinter paste was used for bonding in a nitrogen reflow oven at a sintering temperature of 260 °C for 60 min without pressure; it achieved a die-shear strength of 47 MPa. Stencil-printing and screw-dispensing methods are employed in the printing process. A die-shear strength of 40 MPa or higher is obtained for a sintering temperature in the range of 260 °C or higher. The sintering process requires a non-oxidizing atmosphere (e.g., nitrogen or vacuum), and the maximum bondable chip size is 5 mm 5 mm. Chips that are 7 mm 7 mm or larger cannot bond stably because of the generation of large voids and cracks. Copper, silver, palladium, and platinum are used as adherents, and their die-shear strengths are greater than 40 MPa. The results confirm that the developed Cu sinter paste can be sin-tered using conventional bonding equipment used for soldering, which offers the potential to achieve high bonding reliability and high thermal conductivity as copper sintering bonds.