Wetting Force-Assisted Solvent-Drying Method for Large-Area, Low- or No-Pressure Sintering

Konferenz: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06.05.2025 - 08.05.2025 in Nürnberg, Germany

doi:10.30420/566541118

Tagungsband: PCIM Conference 2025

Seiten: Sprache: EnglischTyp: PDF

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Autoren:
Yamasaki, Masanao; Koseki, Katsuya; Doi, Shinsuke; Tadano, Akiyoshi; Yoshida, Isamu

Inhalt:
Effective solvent drying is important for productivity and reliability during the sintering process, particularly in the case of large-area, low- or no-pressure sintering. Herein, we propose a solvent-drying method that utilizes the wetting force. Generally, rough surfaces enhance wettability. We hypothesized that the solvent would be actively drawn out along the surface by an increased wetting force, allowing faster solvent drying. In validation experiments, the proposed method reduced the voids caused by solvents that could not be fully dried and confirmed that roughened surfaces did not negatively affect the reliability of the sintered layer during a thermal shock test.