HV LinPak Platform Featuring Si IGBT Trench and SiC Technology for Enhanced Traction Reliability
Konferenz: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06.05.2025-08.05.2025 in Nürnberg, Germany
doi:10.30420/566541127
Tagungsband: PCIM Conference 2025
Seiten: 7Sprache: EnglischTyp: PDF
Autoren:
Kicin, Slavo; Ehrbar, Roman; Botan, Virgiliu; Santolaria, Lluis; Roesch, Andreas; Boksteen, Boni; Baschnagel, Andreas; Jones, Jeremy; Bayer, Martin; Ceccarelli, Edoardo; Musse, Mohamed; De Michielis, Luca; Maleki, Milad
Inhalt:
This paper presents the Hitachi Energy HV LinPak platform, highlighting the 3.3 kV, 600 A rated product version, which features a new generation trench chip set optimized for lowest conduction losses. This makes it suited for the best performance for three and multi-level converter designs. The testing results confirmed the robustness, balanced electromagnetic design and reliability of the module.