Physical Network Model and Experimental Investigation of an Active Cooling Loop for Power Electronic

Inhalt:
This study investigates an active water cooling system at the system level, designed to analyze the heat dissipation of power electronic devices. The system-level investigation includes all system components, the environment, and their interactions. The components interact with each other and the environment through heat transfer. Both thermal and fluid dynamic behavior of the system are evaluated by using a physical network model. The network model is validated with test results. Key parameters such as coolant flow rate, heat exchanger fan speed, power electronics heat loss are systematically changed to asses the correlation between simulated and measured variables. This study contributes to the understanding of active cooling of power electronics and enables more complicated system simulation as the physical model of the components is scalable and can be connected in different configuration.