Thermal Modeling of SiC Power Module: A CFD-Based Approach for Junction-to-Fluid Resistance Estimate
Konferenz: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06.05.2025-08.05.2025 in Nürnberg, Germany
doi:10.30420/566541305
Tagungsband: PCIM Conference 2025
Seiten: 8Sprache: EnglischTyp: PDF
Autoren:
Ferretti, Jacopo; Colombini, Lorenzo; Nerone, Mariano; Valic, Igor; Ferrarese, Filippo; Schiapparelli, Giacomo Piero; Tallarico, Andrea Natale
Inhalt:
This paper presents a thermal analysis methodology for modeling the junction-to-fluid thermal resistance of an automotive-grade SiC power module using computational fluid dynamics (CFD) simulations based on manufacturer datasheet data. The resulting thermal resistance map enables accurate electro-thermal simulations across a wide range of operating conditions and geometries, improving predictive capabilities in the design and optimization of electronic power systems.