3D Wiring Technology Development for Power Modules to Achieve High -Power Density and High High-Frequency Switching

Inhalt:
A new low low-loss, high high-power density SiC module using 3D wiring technology is introduced. In contrast to conventional copper clip wiring methods, a 3D -wiring structure utilizing a circuit board with multiple wiring layers and copper pins are applied to the new SiC module for achieving both low inductance and high-power density. This paper describes the new 3D wiring structure through assessments of induct- ance and losses via switching evaluations, as well as evaluations of allowable current. The 3D wiring structure demonstrates a 30% reduction in switching losses compared to conventional copper clip structures, while also doubling the power density. The power module developed with this new 3D wiring structure has the potential to contribute to the miniaturization, increased power output, and improved efficiency of in verters when applied to xEVs.