Back-to-Back Test Benches for Application-Close Evaluation of Power Electronics

Konferenz: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06.05.2025 - 08.05.2025 in Nürnberg, Germany

doi:10.30420/566541393

Tagungsband: PCIM Conference 2025

Seiten: Sprache: EnglischTyp: PDF

Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt

Autoren:
Degrenne, Nicolas; Quemener, Vincent; Regnat, Guillaume; Ouhab, Merouane; Pichon, Pierre-Yves

Inhalt:
Back-to-back test benches are increasingly used in research for testing power electronics components and systems in application-close conditions and apprehend their reliability and electrical performances. The objective of this paper is to present a polyvalent back-to-back test bench architecture for power modules and exemplify its ability to support R&D with original application-close mission profile replication, failure mode reproduction, lifetime modeling, condition monitoring and soft-switching loss estimation. It highlights the value of back-to-back test benches for R&D laboratories involved in power module testing and opens a discussion on standardization.