The new intelligent power module, CIPOS (exp TM) Mini DCB IPM with 7th generation IGBTs for motor drive applications

Inhalt:
This paper introduces the new generation CIPOS(TM) Mini family. It is an intelligent power module (IPM) dual in-line package with transfer molding for 3-phase AC motors, and permanent magnet motors in variable speed motor drives applications. The CIPOS(TM) Mini integrates the 650 V rated IGBT 7, emitter controlled 3 (EC 3) diodes, a 6-channel silicon-on-insulator (SOI) gate driver, and protection circuit in a dual in-line, direct copper bonding (DCB) transfer-molded package. It uses 7th generation TRENCHSTOPTM IGBTs with micro-pattern trench technology that offer reduced losses, improved efficiency, and higher power density compared to previous versions.