Multi-functional Chip Contributes to the Compact Design of Automotive SiC Power Module
Konferenz: PCIM Asia Shanghai Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
24.09.2025-26.09.2025 in Shanghai, China
doi:10.30420/566583064
Tagungsband: PCIM Asia Shanghai Conference 2025
Seiten: 5Sprache: EnglischTyp: PDF
Autoren:
Zhao, Lizhong; Huang, Hongguang; Yoshida, Kentaro
Inhalt:
With the rapid development of the electric vehicle industry, the performance requirements for electric drive units are increasing day by day. Traditional Si-based semiconductor materials have gradually reached their physical limits, and it is difficult to meet the market demand for high-power-density and high-efficiency electric drive units. SiC (silicon carbide) materials have become the key material to improve the performance of electric drive units due to their excellent performance advantages. The purpose of this paper is to explore the application of Mitsubishi Electric’s latest J3 series SiC modules in electric vehicle. This article first introduces J3 series SiC modules, which will be mass-produced, and then elaborates on Mitsubishi Electric's original design, multi-functional chip, which can help to decrease the size of power module. Finally, through comparative analysis, the superiority of the J3 series SiC power module in improving the size of the electric drive system is verified.

