Analysis and Study on the Advantages of one Innovative SiC Chip Embedding PCB Solution for xEV Main Inverter Application
Konferenz: PCIM Asia Shanghai Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
24.09.2025-26.09.2025 in Shanghai, China
doi:10.30420/566583078
Tagungsband: PCIM Asia Shanghai Conference 2025
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
Zhang, Hao; Matthias, Ippisch; Xu, Wen; Nico, Fontana; Jing, Xiaobo
Inhalt:
The paper introduced an innovative module concept of an embedding PCB solution of Infineon's 1.2kV SiC S-cell inside. Compared with traditional SiC module solution, the thermal performance (both the steady state and transient thermal resistance) and electrical performance (system stray inductance and switching losses) of device level was analyzed by Ansys and SPICE simulations. Final, the inverter output capacity and light load efficiency of system level was studied by PLECS simulation.