Board Level Reliability of Micro-Leaded Automotive MOSFETs of Varying Package Dimensions

Inhalt:
This paper aims to look into the effect of package dimension and its effects on Board Level Reliability (BLR). Within the realm of low-voltage automotive silicon MOSFETs, there are a plethora of standard packages that are used in a wide variety of applications. Many of these applications will undergo harsh temperature fluctuations as vehicles are a global commodity required to operate in all climates and conditions. This paper will look into the performance of three different sized micro-leaded automotive MOSFET packages, to see whether a trend exists between package size and BLR.