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21

Fault tolerant drives for aerospace applications

Authors:
Atkinson, G. J.; Bennett, J. W.; Mecrow, B. C.; Atkinson, D. J.; Jack, A. G.; Pickert, V.
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

22

First Power Cycling Results of Improved Packaging Technologies for Hybrid Electrical Vehicle Applications

Authors:
Hensler, Alexander; Lutz, Josef; Thoben, Markus; Guth, Karsten
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

23

Future Role of Power Electronics

Authors:
Omura, Ichiro
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

24

High Temperature Electronics for High Power Density DC-DC Converters and Motor Drives

Authors:
Delatte, Pierre; Dessard, Vincent; Saib, Aimad; Pequignot, Nicolas; Picún, Gonzalo; Demeûs, Laurent; Doucet, Jean-Christophe; Krebs, Thomas
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

25

High-Density System Integration for Medium Power Applications

Authors:
Boroyevich, Dushan; Chen, Zheng; Luo, Fang; Ngo, Khai; Ning, Puqi; Wang, Ruxi; Zhang, Di; Wang, Fred; Burgos, Rolando; Lai, Rixin; Wang, Shuo
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

26

How Materials Behaviour affects Power Electronics Reliability

Authors:
Poech, Max H.
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

27

Importance of Boundary Conditions for Optimizing the Thermal Dimensioning of PCB Traces

Authors:
Coppola, L.; Agostini, B.; Schmidt, R.; Barcelos, R. Faria
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

28

Inductive Parasitics in Power Semiconductor Modules subject to Multi-Objective Optimisation

Authors:
Förster, Stefan; Lindemann, Andreas
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

29

Innovative materials of automotive power packaging

Authors:
Tan, Ky Lim; Vivet, Laurent; Morelle, Jean Michel; Pierre, Bertrand; Bienvenu, Yves; Kaabi, Abderrahmen
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

30

Insulating IGBT Driver with PCB integrated capacitive coupling elements

Authors:
Zeltner, Stefan
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

31

Integrable Semiconductor Current Balancer for Paralleled Fluorescent Lamps

Authors:
Weger, Robert
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

32

Integrated gate driver circuit solutions

Authors:
Herzer, R.
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

33

Integrated rectenna circuit for microwave power scavenging

Authors:
Merabet, Boubekeur; Takhedmit, Hakim; Allard, Bruno; Cirio, Laurent; Costa, François; Picon, Odile; Vollaire, Christian
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

34

Interface Degradation of Al Heavy Wire Bonds on Power Semiconductors during Active Power Cycling measured by the Shear Test

Authors:
Goehre, Jens; Schneider-Ramelow, Martin; Geißler, Ute; Lang, Klaus-Dieter
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

35

Investigation and PEEC Based Simulation of Radiated Emissions Produced by Power Electronic Converters

Authors:
Domurat-Linde, André; Hoene, Eckart
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

36

Is it the End of the Road for Silicon in Power Conversion?

Authors:
Lidow, Alex
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

37

Knowledge Matrix for Power Electronics – The Approach of the ZVEI Working Group 'High Temperature and Power Electronics'

Authors:
Rittner, Martin; Roth, Alexander
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

38

Low temperature sinter technology - Die attachment for power electronic applications

Authors:
Göbl, C.; Faltenbacher, J.
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

39

Mechanical Characterization of an Au-Ge Solder Alloy for High Temperature Electronic Devices

Authors:
Msolli, Sabeur; Dalverny, Olivier; Alexis, Joel; Karama, Moussa
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

40

Mixed switched mode and linear Lithium Ion Battery Tester for high Power and large Bandwidth

Authors:
Fischnaller, M.; Melbert, J.
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems