21
Development of chemical mechanical polishing process for carbon nanotube interconnects on 300 mm wafer
Authors:
Ito, Ban; Nishide, Daisuke; Matsumoto, Takashi; Katagiri, Masayuki; Saito, Tatsuro; Wada, Makoto; Watanabe, Masahito; Sakuma, Naoshi; Kajita, Akihiro; Sakai, Tadashi
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
22
Development of Innovative Tunable Polishing Formulations for Chemical Mechanical Planarization of Silicon Nitride, Silicon Carbide, and Silicon Oxide Materials
Authors:
Schlueter, James; Stoeva, Savka; Graham, Maitland; Shi, Tom
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
23
Development of linear roll CMP system for large area micropatterns
Authors:
Kim, Seongsoo; Kim, Jiyoon; Lee, Changsuk; Jeong, Haedo
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
24
Development of new copper post-CMP cleaning solutions that allow direct bonding
Authors:
Ouerd, Aziz; Dulphy, Hervé; Lelièvre, Vincent; Cioccio, Léa Di; Rivoire, Maurice
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
25
Direct Polish STI HSS CMP with Improved Planarity and Defect Performance
Authors:
Iyer, A.; Yang, T.; Li, T.; Diao, J.; Lee, C. H.; Leung, G.; Osterheld, T.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
26
Effect of process parameter on particle removal efficiency in brush scrubber cleaning
Authors:
Mei, Hegeng; Wang, Jie; Lu, Xinchun
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
27
Effect of Slurry Chemistry on W CMP Performance
Authors:
Kang, Mincheol; Kim, Kyungbo; Jung, Taeyeon; Park, Hyungsoon; Kim, Hyunghwan; Kang, Hyosang
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
28
Evaluation of Glass Lapping using Fixed Abrasive Pad
Authors:
Kim, Hyuk-Min; Manivannan, R.; Moon, Deog-Ju; Kwon, Tae-Young; Noh, Jin-Hyeong; Park, Jin-Goo
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
29
Experimental Studies on Interfacial Fluid Lubrication and Wafer Status during Chemical Mechanical Polishing of 12-inch Wafer
Authors:
Zhao, Dewen; Wang, Tongqing; He, Yongyong; Lu, Xinchun
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
30
Feature analysis and simulation of optical endpoint traces in tungsten CMP
Authors:
Mazzone, Giovanni; Gianni, Davide M.; Bano, Giuseppe; Castelletti, Luca
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
31
FullVision™ Endpoint for CMP of SiGe Fin Structures
Authors:
Menk, G.; Dhandapani, S.; Huang, Y.-C.; Wood, B.; Qian, J.; Cherian, B.; Garretson, C.; Osterheld, T.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
32
Global Thickness Measurement System for Metal Layer on Wafer
Authors:
Yu, Qiang; Zhao, Dewen; Li, Hongkai; Qu, Zilian; Qian Zhao; Lu, Xinchun; Meng, Yonggang
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
33
Haze used as wafer, die and intra-die indirect characterization technique for advanced CMP processes on patterned wafers
Authors:
Dettoni, F.; Beitia, C.; Euvrard, C.; Morand, Y.; Gaillard, S.; Hinsinger, O.; Bertin, F.; Rivoire, M.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
34
Identification of Nonlinear Viscoelasticity of Polishing Pad Using an On- Machine Compression Tester
Authors:
Suzuki, Norikazu; Asaba, Masakazu; Hashimoto, Yohei; Shamoto, Eiji
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
35
Improvements in Profile Control using ISPC™ System During the Stop-in- Oxide CMP Step in the RMG Process Flow on IBM 20nm Short-Loop Wafers
Authors:
Komarenko, P.; Qian, J.; Salfelder, J.; Levedakis, D.; Economikos, L.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
36
In Situ Profile Control with Titan Edge™ Heads for Dielectric Planarization of Advanced CMOS Devices
Authors:
Dhandapani, S.; Qian, J.; Cherian, B.; Menk, G.; Garretson, C.; Lee, H.; Bennett, D.; Osterheld, T.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
37
Influence of different anneal processes on copper surfaces pre - and post - CMP
Authors:
Rudolph, C.; Wachsmuth, H.; Bartusseck, I.; Dobritz, S.; Grafe, J.; Boettcher, M.; Wolf, M. J.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
38
Innovative Barrier CMP Process: Benefit of High Selective Approach on Morphological and Electrical Performances
Authors:
Robin, O.; Nemouchi, F.; Charrion, E.; Hinsinger, O.; Galpin, D.; Rivoire, M.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
39
Interferometry: a direct die level characterization technique
Authors:
Dettoni, F.; Beitia, C.; Morand, Y.; Euvrard, C.; Balan, V.; Peak, J.; Gaillard, S.; Hinsinger, O.; Bertin, F.; Rivoire, M.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
40
Investigation on Analysis and Design of Pad Conditioning Process in Double Side Polishing
Authors:
Lee, Sangjik; Kim, Hyoungjae; Lee, Hyunseop; Jeong, Haedo
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology