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21

Development of chemical mechanical polishing process for carbon nanotube interconnects on 300 mm wafer

Authors:
Ito, Ban; Nishide, Daisuke; Matsumoto, Takashi; Katagiri, Masayuki; Saito, Tatsuro; Wada, Makoto; Watanabe, Masahito; Sakuma, Naoshi; Kajita, Akihiro; Sakai, Tadashi
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

22

Development of Innovative Tunable Polishing Formulations for Chemical Mechanical Planarization of Silicon Nitride, Silicon Carbide, and Silicon Oxide Materials

Authors:
Schlueter, James; Stoeva, Savka; Graham, Maitland; Shi, Tom
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

23

Development of linear roll CMP system for large area micropatterns

Authors:
Kim, Seongsoo; Kim, Jiyoon; Lee, Changsuk; Jeong, Haedo
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

24

Development of new copper post-CMP cleaning solutions that allow direct bonding

Authors:
Ouerd, Aziz; Dulphy, Hervé; Lelièvre, Vincent; Cioccio, Léa Di; Rivoire, Maurice
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

25

Direct Polish STI HSS CMP with Improved Planarity and Defect Performance

Authors:
Iyer, A.; Yang, T.; Li, T.; Diao, J.; Lee, C. H.; Leung, G.; Osterheld, T.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

26

Effect of process parameter on particle removal efficiency in brush scrubber cleaning

Authors:
Mei, Hegeng; Wang, Jie; Lu, Xinchun
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

27

Effect of Slurry Chemistry on W CMP Performance

Authors:
Kang, Mincheol; Kim, Kyungbo; Jung, Taeyeon; Park, Hyungsoon; Kim, Hyunghwan; Kang, Hyosang
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

28

Evaluation of Glass Lapping using Fixed Abrasive Pad

Authors:
Kim, Hyuk-Min; Manivannan, R.; Moon, Deog-Ju; Kwon, Tae-Young; Noh, Jin-Hyeong; Park, Jin-Goo
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

29

Experimental Studies on Interfacial Fluid Lubrication and Wafer Status during Chemical Mechanical Polishing of 12-inch Wafer

Authors:
Zhao, Dewen; Wang, Tongqing; He, Yongyong; Lu, Xinchun
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

30

Feature analysis and simulation of optical endpoint traces in tungsten CMP

Authors:
Mazzone, Giovanni; Gianni, Davide M.; Bano, Giuseppe; Castelletti, Luca
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

31

FullVision™ Endpoint for CMP of SiGe Fin Structures

Authors:
Menk, G.; Dhandapani, S.; Huang, Y.-C.; Wood, B.; Qian, J.; Cherian, B.; Garretson, C.; Osterheld, T.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

32

Global Thickness Measurement System for Metal Layer on Wafer

Authors:
Yu, Qiang; Zhao, Dewen; Li, Hongkai; Qu, Zilian; Qian Zhao; Lu, Xinchun; Meng, Yonggang
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

33

Haze used as wafer, die and intra-die indirect characterization technique for advanced CMP processes on patterned wafers

Authors:
Dettoni, F.; Beitia, C.; Euvrard, C.; Morand, Y.; Gaillard, S.; Hinsinger, O.; Bertin, F.; Rivoire, M.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

34

Identification of Nonlinear Viscoelasticity of Polishing Pad Using an On- Machine Compression Tester

Authors:
Suzuki, Norikazu; Asaba, Masakazu; Hashimoto, Yohei; Shamoto, Eiji
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

35

Improvements in Profile Control using ISPC™ System During the Stop-in- Oxide CMP Step in the RMG Process Flow on IBM 20nm Short-Loop Wafers

Authors:
Komarenko, P.; Qian, J.; Salfelder, J.; Levedakis, D.; Economikos, L.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

36

In Situ Profile Control with Titan Edge™ Heads for Dielectric Planarization of Advanced CMOS Devices

Authors:
Dhandapani, S.; Qian, J.; Cherian, B.; Menk, G.; Garretson, C.; Lee, H.; Bennett, D.; Osterheld, T.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

37

Influence of different anneal processes on copper surfaces pre - and post - CMP

Authors:
Rudolph, C.; Wachsmuth, H.; Bartusseck, I.; Dobritz, S.; Grafe, J.; Boettcher, M.; Wolf, M. J.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

38

Innovative Barrier CMP Process: Benefit of High Selective Approach on Morphological and Electrical Performances

Authors:
Robin, O.; Nemouchi, F.; Charrion, E.; Hinsinger, O.; Galpin, D.; Rivoire, M.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

39

Interferometry: a direct die level characterization technique

Authors:
Dettoni, F.; Beitia, C.; Morand, Y.; Euvrard, C.; Balan, V.; Peak, J.; Gaillard, S.; Hinsinger, O.; Bertin, F.; Rivoire, M.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

40

Investigation on Analysis and Design of Pad Conditioning Process in Double Side Polishing

Authors:
Lee, Sangjik; Kim, Hyoungjae; Lee, Hyunseop; Jeong, Haedo
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology